Semiconductor Band Gap: How Doping and Temperature Control Conductivity

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E_g = 1.12 eV, n_i = 1.5×10¹⁰ cm⁻³

Silicon at 300 K has a band gap of 1.12 eV. With 10¹⁷ cm⁻³ N-type doping, the Fermi level shifts 0.41 eV above mid-gap, and the minority hole concentration is about 2.25×10³ cm⁻³.

Formula

E_g(T) = E_g(0) − α × T² / (T + β)
n_i = √(N_c × N_v) × exp(−E_g / (2kT))
E_F − E_i = kT × ln(N_d / n_i)
n × p = n_i²

The Forbidden Energy Gap

In a crystalline semiconductor, quantum mechanics dictates that electrons can only occupy specific energy ranges called bands. Between the valence band (filled with electrons at absolute zero) and the conduction band (empty at absolute zero) lies the band gap — a range of energies no electron can possess. This gap is what makes a semiconductor a semiconductor: small enough that thermal energy or light can kick electrons across it, large enough that conductivity can be precisely controlled.

Temperature and the Varshni Equation

The band gap is not fixed — it shrinks as temperature rises. The Varshni empirical formula E_g(T) = E_g(0) − αT²/(T + β) captures this behavior accurately. For silicon, E_g decreases from 1.17 eV at 0 K to 1.12 eV at 300 K. This temperature dependence has cascading effects: it increases intrinsic carrier concentration exponentially, shifts LED emission wavelengths, reduces solar cell voltages, and increases transistor leakage currents.

Doping: Engineering the Fermi Level

Pure silicon at room temperature has only about 1.5 × 10¹⁰ free electrons per cubic centimeter — orders of magnitude too few for practical devices. Doping introduces controlled impurities: phosphorus (5 valence electrons) donates an extra electron per atom, while boron (3 valence electrons) creates a hole. At 10¹⁷ cm⁻³ doping, the majority carrier concentration exceeds the intrinsic value by seven orders of magnitude, and the Fermi level shifts from mid-gap toward the relevant band edge.

The Mass-Action Law

One of the most elegant relationships in semiconductor physics is the mass-action law: n × p = n_i², where n is the electron concentration, p is the hole concentration, and n_i is the intrinsic concentration. Doping increases one carrier type while the other decreases reciprocally. At 10¹⁷ cm⁻³ N-type doping in silicon, electrons number 10¹⁷ per cm³ while holes drop to just 2,250 per cm³. This enormous asymmetry is what makes PN junctions, transistors, and every semiconductor device possible.

FAQ

What is a semiconductor band gap?

The band gap is the energy difference between the valence band (where electrons are bound) and the conduction band (where electrons move freely). For silicon, it's 1.12 eV at 300 K. Materials with E_g < ~3.5 eV are semiconductors; wider gaps are insulators. The gap determines electrical, optical, and thermal properties.

How does doping change semiconductor behavior?

Doping introduces impurity atoms that donate extra electrons (N-type, e.g., phosphorus in silicon) or accept electrons to create holes (P-type, e.g., boron in silicon). This shifts the Fermi level toward the conduction or valence band and increases conductivity by orders of magnitude compared to the intrinsic semiconductor.

Why does band gap change with temperature?

Temperature affects the lattice spacing and electron-phonon interactions. The Varshni equation E_g(T) = E_g(0) − αT²/(T+β) models this: silicon's gap shrinks from 1.17 eV at 0 K to 1.12 eV at 300 K. This shift affects LED color, solar cell voltage, and transistor leakage.

What is intrinsic carrier concentration?

Intrinsic carrier concentration n_i is the number of thermally generated electron-hole pairs in a pure semiconductor. For silicon at 300 K, n_i ≈ 1.5 × 10¹⁰ cm⁻³. It increases exponentially with temperature and decreases with larger band gap, following n_i = √(N_c N_v) × exp(−E_g/2kT).

Sources

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