SLA Curing Simulator: Photopolymerization Depth & UV Exposure

simulator intermediate ~10 min
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Cd = 250 μm — optimal cure depth for 100 μm layers

At 50 mW, 8 s exposure, Dp=150 μm and Ec=15 mJ/cm², the cure depth is 250 μm — providing 150 μm of overcure for strong interlayer bonding while maintaining good Z-resolution.

Formula

Cd = Dp × ln(E / Ec) (Jacobs cure depth equation)
E = 2P / (π × v × w₀) (scanning exposure, mJ/cm²)
Dp = 1 / (2.3 × ε × [PI]) (Beer-Lambert penetration depth)

Light Becomes Solid

Stereolithography converts liquid resin into solid plastic using the energy of ultraviolet light. When a UV photon strikes a photoinitiator molecule dissolved in the resin, it generates a free radical that triggers a chain reaction of monomer crosslinking. Within milliseconds, a liquid drop transforms into a rigid polymer network. By precisely controlling where light strikes, SLA builds objects with resolution measured in tens of micrometers — the finest of any 3D printing technology.

The Jacobs Equation

The cure depth Cd = Dp × ln(E/Ec) is the master equation of SLA. It states that polymerization depth depends logarithmically on the ratio of delivered energy E to the critical threshold Ec, scaled by the resin's optical penetration depth Dp. This logarithmic relationship means doubling the laser power does not double the cure depth — it adds only one Dp of additional penetration, a crucial insight for process optimization.

Balancing Cure and Overcure

Every SLA layer must cure slightly deeper than the layer thickness to bond with the previously cured layer below. This deliberate overcure — typically 20-50 μm — ensures structural integrity. But excessive overcure causes overhanging features to thicken, distorting dimensional accuracy. The simulator lets you tune exposure to find the sweet spot: enough overcure for adhesion, not so much that geometry suffers.

Resin Chemistry Matters

The penetration depth Dp and critical exposure Ec are resin properties, not machine settings. Clear resins have large Dp (deep penetration, risk of overcure), while pigmented or filled resins have small Dp (shallow cure, need for higher exposure). Photoinitiator concentration, monomer reactivity, and UV absorber additives all interact to define the working curve. The simulator abstracts these into Dp and Ec, letting you explore how resin chemistry governs the SLA process window.

FAQ

How does SLA 3D printing work?

Stereolithography (SLA) uses a UV laser to selectively cure liquid photopolymer resin layer by layer. The laser traces each cross-section on the surface of a resin vat; where UV light strikes, photoinitiator molecules generate free radicals that crosslink acrylate monomers into a solid polymer. The build platform then lowers by one layer height, and the process repeats.

What is the Jacobs working curve?

The Jacobs working curve, developed by Paul Jacobs at 3D Systems, describes cure depth as Cd = Dp × ln(E/Ec), where Dp is the penetration depth of UV light in the resin, E is the surface exposure energy, and Ec is the critical exposure threshold for gelation. This equation is fundamental to all SLA process planning.

Why does overcure matter?

Overcure occurs when the laser cures deeper than one layer thickness, polymerizing into the previous layer. Some overcure (20-50 μm) is desirable for interlayer bonding, but excessive overcure distorts overhanging features and reduces Z-axis accuracy. The exposure must be tuned to balance bonding against dimensional fidelity.

What determines SLA resolution?

XY resolution depends on laser spot size (typically 25-140 μm) and light scattering in the resin. Z resolution depends on layer height (25-100 μm) and overcure control. SLA achieves the finest feature resolution of any 3D printing technology, routinely producing 50 μm features suitable for microfluidics and dental models.

Sources

Embed

<iframe src="https://homo-deus.com/lab/additive-manufacturing/sla-curing/embed" width="100%" height="400" frameborder="0"></iframe>
View source on GitHub